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               Electronics-Related Materials
    CMP Slurry <GPX>   Semiconductor-Related
  for STI     inquiry     CMP Slurry
    Hitachi Chemical is a leading company of C e O 2 slurry for STI. "GPX" is excellent for polishing and it is suitable for finer patterns.      for STI
         for Metals
      Die Bonding Paste
         for Lead Frame
         for Substrate
         Die Bonding Film
         DF, HS Series
               Dicing Die Bonding Film
   CMP Slurry <GPX>      Underfill Film
  for Metals     inquiry     Epoxy Molding Compound
    "GPX" has two types: HS-C series for Cu and HS-T series for barrier metals. The polishing performance is controllable for various processes and devices.      for Lead Frame
         for Substrate
       Environmentally Friendly Type
         for Power Devices
        Liquid Encapsulants
         CEL-C Series
         Thermoplastic Type
              High Heat Resistant Coating Material
    Die Bonding Paste <EPINAL>      HL Series
  for Lead Frame     inquiry      for Screen Printing HL-P Series
    " EPINAL" has been used as die bonding adhesiv semiconductor devices. We have a top-level market share in die bonding paste.     LOC Tape
         HM Series
      Map Molding Support Tape
         RT Series
      Display & Optics-Related
      Base Materials for PWBs
      Printed Wiring Boards
            Capacitors
    Die Bonding Paste <EPINAL>      Advanced Performance    Products
  for Substrate     inquiry  
   Products Category List
   

" EPINAL" has an excellent adhesion to various materials. adhesiveness is controllable for different chip sizes and die bonding condition. It is available for Pb-free reflow.

     Products Alphabetical List
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       Hitachi Chemical. Co, Ltd.
        
     
     
     
           
    Die Bonding Film <HIATTACH>  
  DF,HS Serires     inquiry  
    DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. We have a top share in the die bonding film market. The uniform die bonding layer can be obtained by a simple laminating process.  
     
   
   
   
     
     
           
    Die Bonding Film <HIATTACH>  
  Dicing Die Bonding Film FH Series inquiry  
    FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it achieves easy handling of thinner wafer.
FH series is a co-developed product with
The Furukawa Electric Co., Ltd.
 
     
   
   
   
   
     
           
    Die Bonding Film <HIATTACH>  
  Underfill Film UF Series inquiry  
    UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods.  
     
   
   
     
     
     
           
    Epoxy Molding Compounds <CEL>  
  for Lead Frame     inquiry  
    Hitachi Chemical has a top-level market share in epoxy molding compounds. Our products meet the customers' demands and the changes of package trends.  
     
   
   
     
     
     
           
    Epoxy Molding Compounds <CEL>  
  for Substrate     inquiry  
    This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also applicable for packages with narrow pad pitch and long wire.  
     
   
     
     
     
     
           
    Epoxy Molding Compounds <CEL>  
  Environmentally Friendly Type HF Serires inquiry  
    "CEL" HF series is an epoxy molding compound without halogen and antimony in the flame retardant. It shows excellent flammability, moldability and reflow crack resistance for various packages.  
     
   
   
     
     
     
           
    Epoxy Molding Compounds <CEL>  
  for Power Devices     inquiry  
    "CEL" with high thermal conductivity and superior moldability is suitable for power devices. The power devices get higher thermal conductivity by combining "CEL" with our high thermal conductive die bonding paste.  
     
   
   
     
     
     
           
    Liquid Encapsulants  
  CEL-C Series     inquiry  
    Hitachi Chemical develops various types of liquid encapsulants along the cutting-edge package trend: TCP, COF, EBGA, wafer level CSP and so on.  
     
   
   
     
     
     
           
    Liquid Encapsulants  
  Thermoplastic Type <HIMAL> HIR Series inquiry  
    HIR series is a thermoplastic liquid encapsulant which forms high heat resistant coating film simply by drying the solvent at the low temperature. It has achieved no-warpage by very small curing shrinkage rate in the drying stage.  
     
   
   
     
     
     
           
    High Heat Resistant Coating Materials <HIMAL>  
  HL Series     inquiry  
    HL series is a high heat resistant coating material which forms high reliable film simply by drying the solvent at below 200oC. The film is suitable for various electronic parts and semiconductor devices by excellent flexibility, toughness and low warpage.  
     
   
   
   
     
     
           
    High Heat Resistant Coating Materials <HIMAL>  
  for Screen Printing HL-P Series inquiry  
    HL-P series is a high heat resistant paste with screen printable capability. It has excellent adhesiveness with Si wafer and polyimides, and it is used as junction coating resin for power devices and compliant layer for wafer level CSP. It is also suitable for non-contact high accuracy dispensing.  
     
   
   
   
     
     
           
   LOC Tape  
  HM Series     inquiry  
    HM series is die bonding tape for LOC packages. It contains a high heat resistant thermoplastic resin in the adhesive, widely known as an overcoating material for semiconductors. It shows excellent stability and easy handling capability.  
     
   
   
     
     
     
           
   Map Molding Support Tape  
  RT Series     inquiry  
    RT series is used in the map molding process of semiconductor packages such as QFN and SON. Attaching on the reverse face of a lead frame, RT series has achieved no flush burr after molding and high productivity in wire bonding. The applications have been expanded to new packages besides QFN and SON, and we are looking for new other applications using the excellent high heat resistance feature.