Hitachi Chemical Co. America, Ltd.

Die Bonding Film

DF,HS Serires

DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. We have a top share in the die bonding film market. The uniform die bonding layer can be obtained by a simple laminating process.

Dicing Die Bonding Film FH Series

FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it achieves easy handling of thinner wafer. FH series is a co-developed product with The Furukawa Electric Co., Ltd.

Underfill Film UF Series

UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods.