DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. We have a top share in the die bonding film market. The uniform die bonding layer can be obtained by a simple laminating process.
FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it achieves easy handling of thinner wafer. FH series is a co-developed product with The Furukawa Electric Co., Ltd.
UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods.