Hitachi Chemical Co. America, Ltd.

N-CS Series

N-CS series is a sheet type cleaning material which removes stains from the molding die used for semiconductor encapsulation. With higher cleaning performance, it can reduce the time to clean-up molding die, compared with conventional cleaning compounds.

Features

  • Reduced time to clean molding die.
  • Good solution for: burrs on the surface of the molding die, stains from gas, and blocking of air vent.
  • Environmentally safe materials, there are less noxious fumes, contamination and corrosion of molding die after cleaning.

How To Use

Image of How to Use

Line-up

Item

Cleaning sheet

Wax sheet

N-CS-2000

N-CS-5710

N-CS-7000

N-CS-3300

Application Conventional EMC

Green compounds

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Clear compounds

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Features Cleaning, recovery of releasability Low temperature cleaning Good cleaning performance, and easy to peel off of the die Applicable for all compounds

Cleaning Performance

Graph of Cleaning Performance
*Tentative data after 300 shot of continuous molding with our green compounds

N-CS W for Small Cavities

  • Completely fills the cavity of the mold die without an air gap.
  • Suitable for molding die with small cavity for small-sized semiconductor, diodes and mini transistor.
  • Designed in a way that the cavity is not blocked when the sheet is set on the mold die in any position.
  • The air inside the cavity can completely escape from it and can remove off stains from the entire cavity.

Image of N-CS W for Small Cavities