Hitachi Chemical Co. America, Ltd.

AH Series

AH series is photosensitive and low temperature curable insulation coating. It can be patterned via photolithography and provides excellent film properties even by low temperature cure.

Features

  • Positive-tone photosensitive and developable by 2.38% TMAH solution as an aqueous developer
  • Low temperature curable (≦200°C)
  • Excellent film properties
  • Suitable for insulation layers in semiconductor packages

Characteristics (Typical Values)

Items Unit AH Series
Applicable film thickness μm 2~20
Exposure dose* mJ/cm2 400
Cure temperature °C 180~200
Glass transition temperature °C >200
Young's modulus GPa 2.0
Elongation % 50
Coefficient of thermal expansion °C 58
Residual stress MPa 20

* 10μm film thickness after cure

Cross Section of AH Series after Cure


Product line-up applicable for various pattern profiles after cure

Application Example of AH Series for Redistribution Insulation Layers on WL-CSP


Application Example of AH Series
for Redistribution Insulation Layers on WL-CSP