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               Electronics-Related Materials
  RT Series     inquiry   Semiconductor-Related
    RT series is a supporting tape used in the map molding process of QFN and SON. Attaching on the reverse face of a lead frame, it has achieved no flush burr after molding and high productivity in wire bonding. The applications has been expanded to new packages besides QFN and SON.     CMP Slurry
         for STI
       for Metals
      Die Bonding Paste
       for Lead Frame
       for Substrate
       Die Bonding Film
               DF, HS Series
    Features      Dicing Die Bonding Film
  Thermoplastic resin with high thermal stability for adhesive layer.      Underfill Film
  Good wire bondability.     Epoxy Molding Compound
  No flash burr after molding.      for Lead Frame
  No adhesive on lead frame after detaping.      for Substrate
  Low adhesiveness of the tape at room temperature achieves no dust attachment .      Environmentally Friendly Type
         for Power Devices
  Packaging process using RT series (map molding type)     Liquid Encapsulants
       CEL-C Series
       Thermoplastic Type
      High Heat Resistant Coating Material
       HL Series
       for Screen Printing HL-P Series
      LOC Tape
       HM Series
      Map Molding Support Tape
    RT Series
    Display & Optics-Related
    Base Materials for PWBs
      Printed Wiring Boards
   Characteristics (Typical Values)   Capacitors
  Item Unit RT-321 RT-521
   Features -- Standard Cu L/F
   Bonding temp. C 200~250 200~250
   Detaping temp.* C 25~200 25
   Flash burr after molding -- None None
   Residue after detaping -- None None
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      * Heating is required for some lead frames and epoxy molding compounds.