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               Electronics-Related Materials
  HM Series     inquiry   Semiconductor-Related
    HM series is die bonding tape for LOC packages. It contains a high heat resistant thermoplastic resin in the adhesive, widely known as an overcoating material for semiconductors. It shows excellent stability and easy handling capability.     CMP Slurry
         for STI
       for Metals
      Die Bonding Paste
         for Lead Frame
         for Substrate
         Die Bonding Film
               DF, HS Series
    Features      Dicing Die Bonding Film
  Bondable in short time with hot-melt type      Underfill Film
  Low outgassing and impurities guarantee high reliability     Epoxy Molding Compound
  High heat resistance and excellent reflow crack resistance      for Lead Frame
  Easy to handle with no adhesiveness at room temperature and excellent stability      for Substrate
         Environmentally Friendly Type
         for Power Devices
        Liquid Encapsulants
         CEL-C Series
         Thermoplastic Type
        High Heat Resistant Coating Material
         HL Series
         for Screen Printing HL-P Series
        LOC Tape
      HM Series
        Map Molding Support Tape
         RT Series
      Display & Optics-Related
      Base Materials for PWBs
      Printed Wiring Boards
         Advanced Performance    Products
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         Hitachi Chemical. Co, Ltd.