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               Electronics-Related Materials
  HL Series     inquiry   Semiconductor-Related
    HL series is a high heat resistant coating material which forms high reliable film simply by drying the solvent at below 200oC. This film is suitable for various electronic parts and semiconductor devices by excellent flexibility, toughness and low warpage.     CMP Slurry
         for STI
       for Metals
      Die Bonding Paste
       for Lead Frame
         for Substrate
  for Screen Printing      Die Bonding Film
               DF, HS Series
    Features      Dicing Die Bonding Film
  High heat resistance.      Underfill Film
  Excellent solvent, acid and alkaline reisitance.     Epoxy Molding Compound
  Film formation at low temperature.      for Lead Frame
  Excellent stress reduction.      for Substrate
         Environmentally Friendly Type
    Applications      for Power Devices
  Junction coating resin for power devices .      CEL-C Series
  Passivation for semiconductor devices .      Thermoplastic Type
      High Heat Resistant Coating Material
    HL Series
       for Screen Printing HL-P Series
      LOC Tape
       HM Series
      Map Molding Support Tape
       RT Series
    Display & Optics-Related
    Base Materials for PWBs
    Printed Wiring Boards
    Capacitors
   Characteristics (Typical Values)      Advanced Performance    Products
 
Item Unit HL-1200 HL-1450
Features -- High heat reisitance Low modulus
 Liquid
 properties
 Solid content % 12 4.8
 Viscosity Pa?s 0.5 1.1
 Resin
 properties
 Tg C 225 180
 Decomposition temp. C 400 390
 CTE ppm/C 50 100
 Elastic modulus MPa 2,600 680
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