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               Electronics-Related Materials
  Thermoplastic Type <HIMAL> HIR Series inquiry   Semiconductor-Related
    HIR series is a thermoplastic liquid encapsulant which forms high heat resistant coating film simply by drying the solvent at the low temperature. It has achieved no-warpage by very small curing shrinkage rate in the drying stage.     CMP Slurry
         for STI
       for Metals
      Die Bonding Paste
         for Lead Frame
         for Substrate
         Die Bonding Film
               DF, HS Series
    Features      Dicing Die Bonding Film
  High heat resistance      Underfill Film
  Low temperature curability     Epoxy Molding Compound
         for Lead Frame
   Applications      for Substrate
  Thermal head printer      Environmentally Friendly Type
  LCD driver IC (TCP/COG)      for Power Devices
  Power devices     Liquid Encapsulants
  BGA      CEL-C Series
  CSP   Thermoplastic Type
        High Heat Resistant Coating Material
         HL Series
         for Screen Printing HL-P Series
        LOC Tape
         HM Series
        Map Molding Support Tape
         RT Series
      Display & Optics-Related
      Base Materials for PWBs
      Printed Wiring Boards
      Capacitors
         Advanced Performance    Products
         Products Category List
         Products Alphabetical List
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