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               Electronics-Related Materials
  CEL-C Series     inquiry   Semiconductor-Related
    Hitachi Chemical develops various types of liquid encapsulants along the cutting-edge package trend: TCP, COF, EBGA, wafer level CSP and so on.     CMP Slurry
         for STI
       for Metals
      Die Bonding Paste
         for Lead Frame
         for Substrate
         Die Bonding Film
               DF, HS Series
    Features      Dicing Die Bonding Film
  Excellent moisture resistance & electrical properties .      Underfill Film
  Excellent adhesion to the various types of substrates.     Epoxy Molding Compound
  Low ionic impurities.      for Lead Frame
  Minimum warpage by low CTE.      for Substrate
         for Power Devices
    Features and Characteristics (Typical Values)     Liquid Encapsulants
 
Applications Products Featuers Curing Conditions
(C/h)
 TCP CEL-C-
5020
It shows excellent film
formability and voltage
resistance.
120C/20min+
150C/2h
 COF
 (Underfill)
CEL-C-
3900
It is a non-filler type material, excellent impregnation and migration resistance 120C/15min+
150C/1h
 FC-BGA
 (Underfill)
CEL-C-
3720
It shows excellent adhesion in humidity and excellent reflow resistance and thermal cycling resistance by making the CTE meet that of solder bmp. 165C/2h
 WL-CSP CEL-C-
7700
It enables to reduce wafer warpage due to low CTE. 130C/1h+
180C/3h
  CEL-C Series
       Thermoplastic Type
      High Heat Resistant Coating Material
       HL Series
       for Screen Printing HL-P Series
      LOC Tape
       HM Series
      Map Molding Support Tape
       RT Series
    Display & Optics-Related
    Base Materials for PWBs
    Printed Wiring Boards
    Capacitors
       Advanced Performance    Products
       Products Category List
       Products Alphabetical List
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