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               Electronics-Related Materials
  for Power Devices     inquiry   Semiconductor-Related
    "CEL" with high thermal conductivity and superior moldability is suitable for power devices. The power devices get higher thermal conductivity by combining "CEL" with our high thermal conductive die bonding paste.     CMP Slurry
         for STI
       for Metals
      Die Bonding Paste
         for Lead Frame
         for Substrate
         Die Bonding Film
               DF, HS Series
    Features      Dicing Die Bonding Film
  High thermal conductivity      Underfill Film
  Excellent filling propeties and moldability     Epoxy Molding Compound
             for Lead Frame
    Applications          for Substrate
    Power transister, power IC and etc.          Environmentally Friendly Type
        for Power Devices
          Liquid Encapsulants
           CEL-C Series
           Thermoplastic Type
          High Heat Resistant Coating Material
           HL Series
           for Screen Printing HL-P Series
        LOC Tape
         HM Series
        Map Molding Support Tape
         RT Series
      Display & Optics-Related
      Base Materials for PWBs
      Printed Wiring Boards
         Advanced Performance    Products
         Products Category List
         Products Alphabetical List
         Hitachi Chemical. Co, Ltd.