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               Electronics-Related Materials
  Underfill Film UF Series inquiry   Semiconductor-Related
    UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods.     CMP Slurry
         for STI
       for Metals
      Die Bonding Paste
         for Lead Frame
  DF, HS Series                     for Substrate
  Dicing Die Bonding Film      Die Bonding Film
               DF, HS Series
    Features      Dicing Die Bonding Film
  Realizable fine pitch interconnection only with the application of heat and pressure .   Underfill Film
  Unnecessary for underfill.
    Epoxy Molding Compound
  Stress reduction between  a chip and a substrate.      for Lead Frame
  2 types are available: one with and one without conductive particles.      for Substrate
     Environmentally Friendly Type
       for Power Devices
      Liquid Encapsulants
       CEL-C Series
       Thermoplastic Type
    Characteristics (Typical Values)     High Heat Resistant Coating Material
Item Unit FC-212K UF-536 Test method
 Conductive particles -- Included None --
 Die bonding  condition  Temp. °C 180 180 --
 Load MPa 1 1 --
 Time s 20 20 --
 Elastic modulus (40) GPa 6.6 6.6 DMA
 Tg °C 172 172 DMA
     HL Series
       for Screen Printing HL-P Series
      LOC Tape
       HM Series
      Map Molding Support Tape
       RT Series
    Display & Optics-Related
    Base Materials for PWBs
    Printed Wiring Boards
    Process   Capacitors
       Advanced Performance    Products
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       Hitachi Chemical. Co, Ltd.