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               Electronics-Related Materials
  Dicing Die Bonding Film FH Series inquiry   Semiconductor-Related
    FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it has achieved easy handling of thinner wafer.

FH series is a co-developed product with
The Furukawa Electric Co., Ltd.
    CMP Slurry
         for STI
       for Metals
      Die Bonding Paste
       for Lead Frame
       for Substrate
  DF, HS Series      Die Bonding Film
      Underfill Film        DF, HS Series
    Features   Dicing Die Bonding Film
  Excellent dicing and pick-up performance.      Underfill Film
  Low lamination temperature to a wafer.     Epoxy Molding Compound
  Excellent wire bondability without film curling .      for Lead Frame
  Excellent reflow crack resistance      for Substrate
             Environmentally Friendly Type
    Characteristics (Typical Values)      for Power Devices
         
Item Unit FH-800 FH-900 FH-9011 Test method
 Adhesive thickness μm 10, 20 10, 20, 25, 40 10, 20, 25, 40 --
 DC tape  properties  Exposure doze mJ/cm2 150~400 150~400 150~400 --
 Adhesive  strength  between DCT  and DBF  Before  UV N/25mm 1.4 1.4 1.4 --
 After  UV N/25mm <0.1 <0.1 <0.1 --
 Wafer laminating temp. °C 60~90 60~90 60~80 --
 Die bonding  condition  Temp. °C 100~160 100~160 100~160 --
 Load MPa 0.05~2.0 0.05~2.0 0.05~2.0 --
 Elastic modulus (35c) MPa 280 200 200 DMA
 Tg °C 165 180 180 TMA
 Die shear strength (260C) N/chip >100 >100 >100 5x5mm chip
    Liquid Encapsulants
       CEL-C Series
       Thermoplastic Type
      High Heat Resistant Coating Material
       HL Series
       for Screen Printing HL-P Series
      LOC Tape
       HM Series
      Map Molding Support Tape
       RT Series
    Display & Optics-Related
    Base Materials for PWBs
    Printed Wiring Boards
    Capacitors
       Advanced Performance    Products
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