DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. We have a top share in the die bonding film market. The uniform die bonding layer can be obtained by a simple laminating process.
Item | Unit | DF-335-7 | DF-402 | DF-470 | HS-270 | Test method | |
---|---|---|---|---|---|---|---|
Thickness | μm | 25 | 15, 25, 40 |
15, 25, 40 |
12.5, 25, 50, 75, 100 | -- | |
Die bonding condition |
Temp. | °C | 230 | 180 | 150 | 120~160 | -- |
Load | MPa | 0.04 | 0.04 | 0.04 | 0.04 | -- | |
Tensile modulus (25°C) | MPa | 2,600 | 2,400 | 2,400 | 1,000 | DMA | |
Tg | °C | 123 | 68 | 76 | 180 | TMA | |
Die shear strength (260°C) | N/chip | >100 | >100 | >100 | >100 | 5x5mm chip |
Wafer backside lamination
Cut and lamination