Electronics-Related Materials
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Semiconductor-Related
DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. We have a top share in the die bonding film market. The uniform die bonding layer can be obtained by a simple laminating process.
CMP Slurry
for STI
for Metals
Die Bonding Paste
for Lead Frame
Dicing Die Bonding Film
for Substrate
Underfill Film
Die Bonding Film
Features of DF Series
Dicing Die Bonding Film
Application
Underfill Film
Epoxy Molding Compound
for Lead Frame
for Substrate
Environmentally Friendly Type
for Power Devices
Features of HS Series
Liquid Encapsulants
Application
CEL-C Series
Thermoplastic Type
High Heat Resistant Coating Material
HL Series
for Screen Printing HL-P Series
LOC Tape
Characteristics (Typical Values)
HM Series
Item
Unit
DF-335-7
DF-402
DF-470
HS-270
Test method
Thickness
μm
25
15, 25,
15, 25,
12.5, 25, 50, 75, 100
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Die bonding condition
Temp. °C
230
180
150
120~160
--
Load MPa
0.04
0.04
0.04
0.04
--
Tensile modulus (25°C)
MPa
2,600
2,400
2,400
1,000
DMA
Tg
°C
123
68
76
180
TMA
Die shear strength (260°C)
N/chip
>100
>100
>100
>100
5x5mm chip
Map Molding Support Tape
RT Series
Display & Optics-Related
Base Materials for PWBs
Printed Wiring Boards
Capacitors
Advanced Performance Products
Products Category List
Products Alphabetical List
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Hitachi Chemical. Co, Ltd.
Process
Wafer backside lamination
Cut and lamination
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DF,HS Serires 
DF, HS Series
Obtainable a uniform bonding layer without void. 
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