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               Electronics-Related Materials
  DF,HS Serires     inquiry   Semiconductor-Related
    DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. We have a top share in the die bonding film market. The uniform die bonding layer can be obtained by a simple laminating process.     CMP Slurry
         for STI
       for Metals
      Die Bonding Paste
       for Lead Frame
  Dicing Die Bonding Film      for Substrate
  Underfill Film                       Die Bonding Film
            DF, HS Series
    Features of DF Series      Dicing Die Bonding Film
 
Obtainable a uniform bonding layer without void. Application
Excellent workability and storage stability.
Excellent reflow crack resistance.
 
 
     Underfill Film
      Epoxy Molding Compound
       for Lead Frame
       for Substrate
       Environmentally Friendly Type
       for Power Devices
    Features of HS Series     Liquid Encapsulants
 
Excellent stress reduction by low elastic modulus . Application
Excellent gap filling capability of substrate.
Applicable for thicker film.
 
 
     CEL-C Series
       Thermoplastic Type
      High Heat Resistant Coating Material
       HL Series
       for Screen Printing HL-P Series
      LOC Tape
    Characteristics (Typical Values)      HM Series
       
Item Unit DF-335-7 DF-402 DF-470 HS-270 Test method
 Thickness μm 25 15, 25,
40
15, 25,
40
12.5, 25, 50, 75, 100 --

 Die bonding  condition

 Temp. °C  230 180 150 120~160 --
 Load MPa 0.04 0.04 0.04 0.04 --
 Tensile modulus (25°C) MPa 2,600 2,400 2,400 1,000 DMA
 Tg °C  123 68 76 180 TMA
 Die shear strength (260°C) N/chip >100 >100 >100 >100 5x5mm chip
    Map Molding Support Tape
       RT Series
    Display & Optics-Related
    Base Materials for PWBs
    Printed Wiring Boards
    Capacitors
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         Hitachi Chemical. Co, Ltd.
    Process    
   
   
   
   
   
   
   
   
  Wafer backside lamination  
   
   
   
   
   
   
   
   
   
   
   
   
 

Cut and lamination