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               Electronics-Related Materials
  for Lead Frame     inquiry   Semiconductor-Related
    " EPINAL" has been used as die bonding adhesive for semiconductor devices. We have a top-level market share in die bonding paste.     CMP Slurry
         for STI
       for Metals
        Die Bonding Paste
      for Lead Frame
         for Substrate
  for Substrate      Die Bonding Film
               DF, HS Series
    Features      Dicing Die Bonding Film
  Excellent workability to eliminate any problems of bonding layer.      Underfill Film
  Fast curability for high productivity.     Epoxy Molding Compound
  Low stress for low warpage and high reliability.      for Lead Frame
  High thermal conductivity.      for Substrate
         Environmentally Friendly Type
    Process      for Power Devices
      Liquid Encapsulants
       CEL-C Series
       Thermoplastic Type
      High Heat Resistant Coating Material
       HL Series
       for Screen Printing HL-P Series
      LOC Tape
       HM Series
      Map Molding Support Tape
       RT Series
      Display & Optics-Related
      Base Materials for PWBs
      Printed Wiring Boards
      Capacitors
         Advanced Performance    Products
 
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