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               Electronics-Related Materials
  for Metals     inquiry   Semiconductor-Related
    "GPX" has two types: HS-C series for Cu and HS-T series for barrier metals. The polishing performance is controllable for various processes and devices.     CMP Slurry
       for STI
    for Metals
        Die Bonding Paste
         for Lead Frame
         for Substrate
  for STI      Die Bonding Film
               DF, HS Series
    Features      Dicing Die Bonding Film
  High removal rate at low down force polishing.      Underfill Film
  Low dishing and erosion.     Epoxy Molding Compound
  Removal selectivity of Cu, TaN, and oxide is tunable.      for Lead Frame
         for Substrate
    CMP Process      Environmentally Friendly Type
       for Power Devices
      Liquid Encapsulants
       CEL-C Series
       Thermoplastic Type
      High Heat Resistant Coating Material
       HL Series
       for Screen Printing HL-P Series
      LOC Tape
       HM Series
      Map Molding Support Tape
       RT Series
  Advanced semiconductor devices with high performance are required to have multi-level   Display & Optics-Related
  layers, fine patterns to obtain high speed transmission. CMP process is indespensable to   Base Materials for PWBs
  have well-planarized interlayer dielectric or metals in LSI and accomplish the above   Printed Wiring Boards
  requirments.   Capacitors
    Characteristics (Typical Values)      Advanced Performance    Products
 
Item Unit HS-H635 HS-T605 HS-T815
 Use   -- for Cu for TaN
 Features   -- Abrasive free like High removal @low down force High selective Non selective
 Removal Rate  Cu A/min. 8,000 250 480
 TaN 40 650 750
 SiO2 -- <50 650
 SiOC -- <50 200
 
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