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   electronics-related products>>semiconductor-related materials    
               Electronics-Related Materials
  HSG     inquiry   Semiconductor-Related
    "HSG" is a new spin-on material (SOG) which is effective on high-speed devices with ULSI multilevel interconnections. It provides excellent properties: high mechanical strength and low water absorption.     Interlayer Dielectric Material
      CMP Slurry
       for STI
         for Metals
        Die Bonding Paste
         for Lead Frame
               for Substrate
    Features      Die Bonding Film
  High mechanical strength and low dielectric constant.      DF, HS Series
  High heat resistance (500oC)      Dicing Die Bonding Film
  HSG-255 can withstand etching, ashing and CMP process.      Underfill Film
        Epoxy Molding Compound
    Characteristics (Typical Values)      for Lead Frame
Item Test condition Unit HSG-255 HSG-R7
Dielectric constant 1MHz -- 2.3 2.8
Elastic modulus Nano indentation GPa 12 4.7
Water absorption TDS 23 ° C ~ 600 ° C Wt% <0.2 <0.2
     for Substrate
       Environmentally Friendly Type
       for Power Devices
      Liquid Encapsulants
       CEL-C Series
  Cross section SEM of HSG-255/Cu Single-damascene      Thermoplastic Type
      High Heat Resistant Coating Material
       HL Series
       for Screen Printing HL-P Series
      LOC Tape
       HM Series
      Map Molding Support Tape
       RT Series
    Display & Optics-Related
    Base Materials for PWBs
      Printed Wiring Boards
         Advanced Performance    Products
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