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               Electronics-Related Materials
  HAE Series and RM Series     inquiry      Advanced Perfromance    Products
    HAE Series  
  Dicing film is an adhesive tape to hold and protect semiconductor wafers from the dicing process to the pickup process. Especially this stretchable film improves the efficiency in the pickup process. Various grades are available to suit the cutting method and the chip size.   Functional Film Products
       Pressure Sensitive Adhesive Film
       Adhesive Film For Display
    Film for Semiconductor Related       Product
  RM Series  
  Release sheet reduces the flash burr in molding of QFN packages etc.      Masking Film for a Plating Process
         Cross-linked foamed polyethylene
         Inorganic dense-packed foam
   Features      Foamed Polyethylene Thermal       Insulation Sleeve
  Various choice of adhesive strength. We are ready to serve a lot of kinds of film and the  
         adhesion strength for various purposes.      SPD Film "LCF-1103DHA"
  Good at expanding.   RFID Products UHF(860- 960MHz)
  Adhesion type and no UV treatment required.  
  Little contamination to a wafer.      Outline of RFID Products
         Ultra Small Package Tag
   Application      Document Tag
  Holding the tips of wafer from dicing process to the pick up process.      Metallic Tag
      Carbon & Ceramics
   Standard Specification   Automotive-Related
         Products Category List
      HAE-1500 series      Products Alphabetical List
 
Item Unit HAE-1525 HAE-1503L HAE-1503 HAE-1503H HAE-1504 HAE-1505 HAE-1506
 Standard adhesion gf/25mn 35 40 50 58 80 130 250
 Dimension  Thickness ƒÊm 80
 Width mm 150
 Length m 100
 Hue of film -  
 Material of film - PVC
 Material of separator - PAPER
 Properties  of  machine  Tensile  strength kgf/cm2 260
 Elongation % 260
 Elastic  modulus kgf/mm2 5.4
 50%  modulus kgf/cm 0.7
 Size of chips - large<>small
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      Note : Standard adhesion means an adhesion to the adherend for which SUS430-BA  
                  plate used,and was measured at an exfoliation angle of 90‹ an exfoliation speed of  
                  200 mm/min and a temperature of 23‹C. Unless otherwise specially indicated, the  
                  data are those measured under the same conditions as above.  
     
      HAE-1600 series  
 
Item Unit HAE-1625 HAE-1603L HAE-1603 HAE-1603H HAE-1604 HAE-1605 HAE-1606
 Standard adhesion gf/25mn 35 40 50 58 80 130 250
 Dimension  Thickness ƒÊm 80
 Width mm 150
 Length m 100
 Hue of film -  
 Material of film - PVC
 Material of separator - OPP film
 Properties  of  machine  Tensile  strength kgf/cm2 260
 Elongation % 260
 Elastic  modulus kgf/mm2 5.4
 50%  modulus kgf/cm 0.7
 Size of chips - large<>small
 
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
      Note : Standard adhesion means an adhesion to the adherend for which SUS430-BA  
                  plate used,and was measured at an exfoliation angle of 90‹ an exfoliation speed of  
                  200 mm/min and a temperature of 23‹C. Unless otherwise specially indicated, the  
                  data are those measured under the same conditions as above.  
     
      Release Sheet RM-4100  
     
   Features  
  RM-4100 is suitable for the general sheet type molding machine.  
  Flat and fine surface is produced by using RM-4100 because the shape of sheets is very  
        stable in the molding process. RM-4100 is tough to wrinkle and the change of the shape by  
        clamping pressure is also small.  
  The particular release layer holds lead frames and terminals tightly to prevent the invasion  
        of epoxy molding compound, and the incidence of the flash burr is dramatically decreased.  
     
   Charateristics  
 
Item Unit RM-4100  
 Structure - Release layer
Base Film
 
 Thickness mm 0.04  
 Tensile strength PMa 40  
 Tensile elongation % 50  
 Width mm 50~300  
 Length m 100  
 Product - Roll (Diameter: Approx. 12cm)  
 
   
   
   
   
   
   
   
   
   
   
     
   Molding Process  
 
Loading RM-4100 and lead frame with chips on mold machine
 
Transferring mold resin into cavities after closing and clamping the molds tightly.
 
Opening the molds and removing the molded lead frame.
 
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
       * The above datasheet is a sample observation value under certain testing conditions, not  
        guaranteed performance.