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                 Electronics-Related Materials
     A   High Density Multi-Wire Board   Semiconductor-Related
        High Elastic Modulus, Low CTE Glass   Display & Optics-Related
  Adhesive Film for Display     Epoxy Multilayer Material   Base materials for PWBs
  Anisotropic Conductive Film for Dispplay   High Heat Resistant Coating Materials   Printed Wiring Boards
    Interconnection and Solder Substitution   High Heat Resistant Coating Materials   Capacitors
  AnodeMaterial for Lithium Ion Batteries     (for Screen Printing)      Advanced Performance    Products
        High Layer and Large Size PWB  
     B   High Tg Glass Epoxy Multilayer Material   Functional Film Products
              Carbon & Ceramics
  Brushes for Appliance and      I   Automotive-Related
    Power Tool Motors            Products Category List
  Brushes for Automobile   Inorganic dense-packed foam   Products Alphabetical List
  Brushes for Micro Motors            HOME
           L      Hitachi Chemical. Co, Ltd.
     C          
        Liquid Polyimides  
  Carbon Sliding Materials   Liquid Encapsulant CEL-C Series  
  CMP Slurry for Metal   Liquid Encapsulant  
  CMP Slurry for STI     Thermoplastic Type  
  Cross-linked foamed polyethylene   LOC Tape <HM Series>  
  Capacitors   Low Dielectric Constant, Low Dissipation  
          Factor, High Heat Resistance Multilayer  
     D     Material <MCL>  
        Low Dissipation Factor, High Heat  
  Dicing Die Bonding Film     Resistance Multilayer Material  
  Die Bonding Film for DF,HS Series   Low Press Temperature,  
  Die Bonding Paste for Lead Frame     Adhesive Film (AS-2600)  
  Die Bonding Paste for Substrate   Low Transmission Loss Material  
  Disc Brake Pads   @ @  
  Drum Brake Units      M  
             
     E   Map Molding Support Tape <RT Series>  
        Masking Film for a Plating Process  
  Epoxy Molding Compound        
    Environmentally Friendly Type      O  
  Epoxy Molding Compound        
    for Lead Frame     Optical Clear Adhesive Materials "FINSET"  
  Epoxy Molding Compound   Film Type  
    for Power Devices   Liquid Type  
  Epoxy Molding Compound        
    for Substrate      P  
             
     F   Package Substrate <Cavity BGA>  
        Package Substrate  
  Foamed Polyethylene Thermal Insulation Sleeve     <High Density Build-up Multilayer Board>  
      Planar Anntena  
  Film for Semiconductor Related Product   Planar Antenna for Forward  
          Looking Radar System  
     G   Pressure Sensitive Adhesive Film  
        Protective film for automotive body  
  Glass Epoxy Copper Clad Laminate (FR-4)   PWB for IC Testers  
  Glass Epoxy Multilayer Material (FR-4)   Photosensitive Dry Film for Rib Patterning  
  Glass-like Carbon        
           R  
     H        
        RFID Products UHF (860-960 MHz)  
  Halogen Free, High Elastic Modulus,        
    Low CTE Multilayer Material      S  
  Halogen Free Multilayer Material        
  <HALOX>   Silicon Carbide (SiC) Ceramics  
  <HALOX-Z>   SPD Film "LCF-1103DHA"  
  High Density Build-up Multilayer Board      
  High Heat Resistance Multilayer Material      T  
    (FR-4)        
  High Elastic Modulus, Low CTE Multilayer   Test Fixture System for Logic IC  
    Materials for Thin Package Substrates   Transparent Conductive Transfer Film  
    <MCL>   @ @  
  Halogen Free, Low Dielectronic Constant,      U  
    High Heat Resistance Multilayer Material        
    <MCL>   Underfill Film  
  Halogen Free, Low Dielectronic Constant,        
    Low Dissipation Factor Multilayer Material      
    <MCL>