HL series is a high heat resistant coating material which forms high reliable film simply by drying the solvent at below 200oC. The film is suitable for various electronic parts and semiconductor devices by excellent flexibility, toughness and low warpage.
HP series is a high heat resistant paste with screen printable capability. It has excellent adhesiveness with Si wafer and polyimides, and it is used as junction coating resin for power devices and compliant layer for wafer level CSP. It is also suitable for non-contact high accuracy dispensing.