hitachi.com  |  hitachi.us  |  hitachi chemical co., ltd.  |   Hitachi Chemical DuPont MicroSystems, LLC.       North America
  |    home    |    products    |    contact us    |
Search by Google
 
 
   
              Electronics-Related Materials
 
Electronics-Related Products
  Semiconductor-Related
              Display & Optics-Related
      Base materials for PWBs
              Printed Wiring Boards
   CMP Slurry   Glass Epoxy Multilayer Material (FR-4)   Capacitors
  for STI   Halogen Free Multilayer Material      Advanced Performance    Products
  for Metal   High Tg Glass Epoxy Multilayer Material  
        High Elastic Modulus, Low CTE Glass   Advanced Film Products
   Die Bonding Paste     Epoxy Multilayer Material   Carbon & Ceramics
  for Lead Frame   Halogen Free, High Elastic Modulus,   Automotive-Related
  for Substrate     Low CTE Multilayer Material      Products Category List
        Low Dissipation Factor, High Heat      Products Alphabetical List
   Die Bonding Film     Resistance Multilayer Material      HOME
  DF,HS Series   Low Transmission Loss Material      Hitachi Chemical. Co, Ltd.
 
  Dicing Die Bonding Film   Glass Epoxy Copper Clad Laminate (FR-4)  
  Underfill film   Low Press Temperature, Adhesive Film  
          (AS-2600)  
   Epoxy Molding Compounds   High Heat Resistance Multilayer Material  
  for Lead Frame     (FR-4)  
  for Substrate   High Elastic Modulus, Low CTE Multilayer  
  Environmentally Friendly Type     Materials for Thin Package Substrates  
  for Power Devices     <MCL>  
        Low Dielectric Constant, Low Dissipation  
   Liquid Encapsulants     Factor, High Heat Resistance Multilayer  
  CEL-C Series     Material <MCL>  
  Thermoplastic Type   Halogen Free, Low Dielectronic Constant,  
          High Heat Resistance Multilayer Material  
   Liquid Polyimides     <MCL>  
  HD MicroSystems, LLC.   Halogen Free, Low Dielectronic Constant,  
        Low Dissipation Factor Multilayer Material  
  High Heat Resistant Coating Materials     <MCL>  
  HL Series        
  for Screen Printing    
             
   LOC Tape   Package Substrate  
  HM Series     <High Density Build-up Multilayer Board>  
        Package Substrate <Cavity BGA>  
   Map Molding Support Tape   High Layer and Large Size PWB  
  RT Series   High Density Build-up Multilayer Board  
        High Density Multi-Wire Board  
    PWB for IC Testers  
        Test Fixture System for Logic IC  
   Anisotropic Conductive Film     @  
  for TAB   Capacitors  
  for COG      
  for Solderless Connective Film   Aluminum Electrolytic Capacitors  
      Screw Terminal Capacitor  
   Transparent Conductive Transfer Film   Radial Type Capacitor  
  MS series   Snap Mount Type Capacitor  
        Aluminum Electrolytic Capacitor for Photo Flash  
   Photosensitive Dry Film for Rib Patterning  
  MB series        
        Plastic Film Capacitors  
   Optical Clear Adhesive Materials "FINSET"   Film capacitors for Power Electronics  
  Film Type   Resin encased type  
  Liquid Type   Resin dip type  
        Tape wrapped type  
      For SMD