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               Electronics-Related Materials
  for COG inquiry   Semiconductor-Related
    This type is available for microscopic bump of bare chip. It has excellent adhesion to glass and Si chip   Display & Optics-Related
        Anisotropic Conductive Film
       for TAB
    for COG
         for Solderless Conntective Film
                                            for TAB     Transparent Conductive Transfer   Film
                                            for Solderless Connective Film  
                                                    MS series
                                                   Photosensitive Dry Film for Rib   Patterning
    Features  
  Microscopic bump applicable      MB series
  High adhesion and high reliability     Optical Clear Adhesive Materials   "FINSET"
  Low contact resistance  
  Short bonding time      Film Type
  For low stress      Liquid Type
      Base Materials for PWBs
    Principle of connection   Printed Wiring Boards
    Capacitors
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       Hitachi Chemical. Co, Ltd.
     
   
     
    Applications  
      - Interconnection between LCD and driver IC  
 
 
 
 
 
 
 
 
 
 
 
 
 
   
   
     
    Characteristics (Typical Values)  
     
Item Unit AC-8000 series  
Application - for COG  
 Fine pitch  capability  Min. contact area m 2 1000  
 Min. space m 10  
 Bonding  condition  Temp. C 170~  
 Time sec 5~  
 Pressure PMa 50~150*  
 
   
   
   
   
   
   
   
   
  *Based on electrode area