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  electronics-related products>>base materials for PWBs    
               Electronics-Related Materials
  MCL-FX-2 EGFA-2 <prepreg> inquiry   Semiconductor-Related
    Transmission loss in the GHz band can be reduced to about 50% of our standard FR-4. Standard glass fabric (E-glass) specification makes drilling and cutting workability as high as that of our standard FR-4. It is suitable for network applications, super computer, measuring equipment, high-frequency modules and antenna application.   Display & Optics-Related
      Base Materials for PWBs
       Glass Epoxy Multilayer Material
       Halogen Free Multilayer Material
       High Heat Resistance Multilayer       Material (FR-4)
   
       High Tg Glass Epoxy Multilayer       Material <MCL>
           
    Features      High Elastic Modulus, Low CTE       Glass Epoxy Multilayer Material
  Transmission loss in the GHz band can be reduced to about 50% of our standard FR-4.  
  Dk and Df are small.      Halogen Free, High Elastic        Modulus, Low CTE Mulilayer        Material
  General-purpose glass fabric (E-glass) specification makes drilling and cutting  
          workability as high as that of our standard FR-4.  
  High Tg, low water absorption and excellent heat resistance.      High Elastic Modulus, Low CTE       Multilayer Materials for       Thin Package Substrates <MCL>
     
    Characteristics  
       Thin Laminate    Low Dissipation Factor, High          Heat Resistance Multilayer       aterial
 
Items Conditions Units Actual Values (t0.8mm) Test Method (IPC TM-650)

 Dielectric  Constant

 
1MHz C-96/20/65 -- 3.50 ~ 3.70 2.5.5.1
1Ghz*1 3.30 ~ 3.50 2.5.5.5
1Ghz*2 3.50 ~ 3.70 2.5.5.9
 Dissipation  Factor 1MHz C-96/20/65 -- 0.0005 ~ 0.0010 2.5.5.1
1Ghz*1 0.0020 ~ 0.0030 2.5.5.5
1Ghz*2 0.0010 ~ 0.0020 2.5.5.9
 Copper Peel  Strength 18m (Low Profile) A kN/m 0.4 ~ 0.7 2.4.8
 Tg TMA C 175 ~ 185 2.4.24
 Solder Heat Resistance  (260C) A Sec. > 300 --
 Water Absorption E-24/50+D-24/23 % 0.03 ~ 0.04 2.6.2.1
 CAF 85C/85% RH, 100V Hrs. > 1000 --
 Flammability (UL-94) A -- V-0 Equivalent 2.3.10
 Decomposition  Temperature(5% Weight  Loss) TGA C 350 ~ 370 2.3.40
 
     Low Transmission Loss Material
       Low Dielectric Constant, Low             Dissipation Factor, High Heat             Resistance MultilayerMaterial             <MCL>
 
 
 
     Halogen Free, Low Dielectric       Constant, High Heat Resistance       Multilayer Material <MCL>
 
 
     Halegon Free, Low Dielectric       Constant, Low Dissipation Factor       Multilayer Material <MCL>
 
 
     Glass Epoxy Copper Clad              Laminate (FR-4)
 
     Low Press Temperature, Adhesive       Film (AS-2600)
 
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  *1) : Measured by Triplate-line Resonator.      Hitachi Chemical. Co, Ltd.
  *2) : Measured by Material Analyzer.