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       Electronics-Related Materials
  MCL-E-679GT EGEA-679GT <prepreg> inquiry   Semiconductor-Related
    MCL-E679GT has halogen free, lower CTE and higher modulus, which is suitable for thin package as SiP and PoP application.   Display & Optics-Related
      Base Materials for PWBs
       Glass Epoxy Multilayer Material
       Halogen Free Multilayer Material
       High Heat Resistance       Multilayer Material (FR-4)
         High Tg Glass Epoxy Multilayer       Material <MCL>
    Features      High Elastic Modulus, Low CTE       Glass Epoxy Multilayer Material
  MCL-E-679GT is effective for reducing warpage of thin PKG because of lower CTE (before  
         and after Tg) and higher modulus.      Halogen Free, High Elastic        Modulus, Low CTE Mulilayer        Material
  By superior electrical properties, It is possible to reduce transmission loss.  
  Using copper profile, it is possible to make fine line by semiadditive process.  
  MCL-E-679GT has good drill processability and CAF restraining property to be adaptable        High Elastic Modulus, Low CTE            Multilayer Materials for Thin            Package Substrates <MCL>
         for high density PKG.  
    Characteristics      Low Dissipation Factor, High          Heat Resistance Multilayer       aterial
       Thin Laminate
Items Conditions Units Actual Values (t0.8mm) Test Method (IPC TM-650)
 Tg TMA ‹C 165 ~ 175 2.4.24
 CTE*1 X (30`120‹C) ppm/‹C 11 ~ 13 2.4.24
Y 11 ~ 13
Z (<Tg) 20 ~ 30
(>Tg) 110 ~ 140
 Copper Peel  Strength 18ƒÊm A kN/m 1.0 ~ 1.2 2.4.8
 Water Absorption E-24/50+D-24/23 % 0.04 ~ 0.06
 Flexural Modulus  (Lengthwise) A GPa 28 ~ 33 2.4.4
 Surface Resistance A ƒÊm 2 ~ 3 2.2.17
 Decomposition Temperature TGA ‹C 340 ~ 360 2.3.40
     Low Transmission Loss Material
     Low Dielectric Constant, Low       Dissipation Factor, High Heat       Resistance MultilayerMaterial       <MCL>
     Halogen Free, Low Dielectric       Constant, High Heat Resistance       Multilayer Material <MCL>
     Halegon Free, Low Dielectric       Constant, Low Dissipation Factor       Multilayer Material <MCL>
     Glass Epoxy Copper Clad              Laminate (FR-4)
     Low Press Temperature, Adhesive       Film (AS-2600)
  Printed Wiring Boards
  *1) : Heating Rate:10‹C/min.      Advanced Performance    Products
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