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               Electronics-Related Materials
  AS-2600     inquiry   Semiconductor-Related
    "Type No. AS-2600" can be laminated under low press temperature and low press conditions. It is suitable for lamination to polyimide film and other metal (ex. nickel).   Display & Optics-Related
      Base Materials for PWBs
       Glass Epoxy Multilayer Material
       Halogen Free Multilayer Material
         High Heat Resistance Multilayer       Material (FR-4)
         High Tg Glass Epoxy Multilayer       Material <MCL>
         High Elastic Modulus, Low CTE       Glass Epoxy Multilayer Material
         Halogen Free, High Elastic        Modulus, Low CTE Mulilayer        Material
         High Elastic Modulus, Low CTE       Multilayer Materials for       Thin Package Substrates <MCL>
         Low Dissipation Factor, High          Heat Resistance Multilayer       aterial
         Low Transmission Loss Material
         Low Dielectric Constant, Low       Dissipation Factor, High Heat       Resistance MultilayerMaterial       <MCL>
         Halogen Free, Low Dielectric       Constant, High Heat Resistance       Multilayer Material <MCL>
         Halegon Free, Low Dielectric       Constant, Low Dissipation Factor       Multilayer Material <MCL>
         Glass Epoxy Copper Clad              Laminate (FR-4)
           Low Press Temperature,            Adhesive Film (AS-2600)
      Printed Wiring Boards
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