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                 Electronics-Related      Materials
  MCL-E-679FG(R) EFG(S), MCL-E-679FGB(S) <Black Type>    
  GEA-679FG(R) E FG(S) <prepreg> inquiry   Semiconductor-Related
    "Type no. MCL-E-679FG" has achieved the UL94V-0 level of flammability without using any compound which includes halogen, antimony or red phosphorous. This material has high-Tg, high elastic modulus and low CTE. So it is suitable for the substrates of plastic package, LCD's driver boards, and high density interconnection and advantageous for the soldering process at high temperature with lead free solder.   Display & Optics-Related
      Base Materials for PWBs
       Glass Epoxy Multilayer Material
       Halogen Free Multilayer Material
       High Heat Resistance       Multilayer Material (FR-4)
   
       High Tg Glass Epoxy Multilayer       Material <MCL>
           
    Features      High Elastic Modulus, Low CTE       Glass Epoxy Multilayer Material
  Halogen free material for environmental concerns.  
  CTE (Z-direction) is about 50% lower than that of our standard FR-4.      Halogen Free, High Elastic        Modulus, Low CTE Mulilayer        Material
  Elastic modulus is about 20% higher than that of our standard FR-4. Even thin laminate  
          has less warpage and deflection  
  Superior heat resistance for soldering.(Suitable for the lead free process)      High Elastic Modulus, Low CTE       Multilayer Materials for       Thin Package Substrates <MCL>
  Surface roughness is about 1/4 of our standard FR-4, and making fine pattern possible.  
     
    Characteristics      Low Dissipation Factor, High          Heat Resistance Multilayer       aterial
  Thin Laminate  
    (t0.8m)  
 
Items Conditions Units FR-4 Test Method (IPC TM-650)
MCL-E-679FG(R) MCL-E-679FG(S)
 Tg TMA ‹C 163 ~ 173 175 ~ 185 2.4.24
 CTE*1   X (30 ~ 120 ‹C) ppm/ ‹C 13 ~ 15 12 ~ 14 2.4.24
Y 13 ~ 15 12 ~ 14
Z (<Tg) 23 ~ 33 20 ~ 30
(>Tg) 140 ~ 170 130 ~ 160

 Copper Peel  Strength

18ƒÊm A kN/m 0.9 ~ 1.1 1.1 ~ 1.2 2.4.8
 Dielectric  Constant 1MHz C-96/20/65 -- 5.2 ~ 5.4 5.0 ~ 5.2 2.5.5.1
 Dissipation  Factor 1MHz C-96/20/65 -- 0.0080 ~ 0.0100 2.5.5.1
 Water  Absorption   E-24/50+D-24/23 % 0.04 ~0.06 0.03 ~ 0.05 2.6.2.1
   Low Transmission Loss Material
     Low Dielectric Constant, Low       Dissipation Factor, High Heat       Resistance MultilayerMaterial       <MCL>
 
 
     Halogen Free, Low Dielectric       Constant, High Heat Resistance       Multilayer Material <MCL>
 
 
     Halegon Free, Low Dielectric       Constant, Low Dissipation Factor       Multilayer Material <MCL>
 
 
     Glass Epoxy Copper Clad              Laminate (FR-4)
 
     Low Press Temperature, Adhesive       Film (AS-2600)
 
  Printed Wiring Boards
  Capacitors
   Advanced Performance    Products
  *1) : Heating Rate:10‹C/min.      Products Category List
         Products Alphabetical List
  Prepreg      HOME
 
Type Glass Cloth Properties
Style Weight (g/m2) Yarn Count (warpxfill) Resin Content (%) Volatile Content (%) Gelation Time (Sec.) Dielectric Thickness after Lamination*1(mm)
 R  Type  0.04 GRZPE 1037 24 69x72 73}2 <1.0 170}30 0.048
 0.06 GRROE 1078 48 53x53 68}2 170}30 0.078
 0.1 GRSKE 2116 104 60x58 58}2 <0.75 0.125
 S  Type  0.04 GSZPE 1037 24 69x72 73}2 <1.0 170}30 0.048
 0.06 GSROE 1078 48 53x53 68}2 170}30 0.078
 0.1 GSSKE 2116 104 60x58 58}2 <0.75 0.125
 Test Method (IPC  TM-650)   2.3.16.1 2.3.19 2.3.18 --
   Hitachi Chemical. Co, Ltd.
   
 
 
 
 
 
 
 
 
 
 
 
 
 
  *1) : The dielectric thickness after lamination is defined as the thickness of one sheet of  
  prepreg when the resin flow is within 5%.  
  This value changes according to the press condition and inner-layer pattern.