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               Electronics-Related Materials
  MCL-E-679F(R) E GEA-679F(R) <prepreg> inquiry   Semiconductor-Related
    "Type No. MCL-E-679F is high elastic modulus and low CTE materials. (20% lower of CTE compared to conventional FR-4.) And it has the properties for higher elasticity, higher barcol hardness.
The warpage is very low, and it is suitable for the substrates of plastic BGA, memory card, memory module boards, base core material for build-up PWB, and LCD's driver boards."
  Display & Optics-Related
      Base Materials for PWBs
       Glass Epoxy Multilayer Material
       Halogen Free Multilayer Material
       High Heat Resistance       Multilayer Material (FR-4)
       High Tg Glass Epoxy Multilayer       Material <MCL>
    Features        High Elastic Modulus, Low      CTE Glass Epoxy Multilayer Material
  The coefficient of thermal expansion is about 20% (in the X and Y-directions) and about  
          50% (in the Z-direction) lower than that of our standard FR-4.      Halogen Free, High Elastic        Modulus, Low CTE Mulilayer        Material
  Elastic modulus is about 30% higher than that of our standard FR-4. Even thin laminate  
          has less warpage and deflection.  
  Superior heat resistance at PCT.      High Elastic Modulus, Low CTE       Multilayer Materials for       Thin Package Substrates <MCL>
  The surface roughness is about 1/4 that of our standard FR-4, making fine pattern possible.  
    Applications      Low Dissipation Factor, High          Heat Resistance Multilayer       aterial
  Semiconductor packages. (FC-BGA, BGA, CSP)  
  Core material for HDI.  
         Low Transmission Loss Material
    Characteristics      Low Dielectric Constant, Low       Dissipation Factor, High Heat       Resistance MultilayerMaterial       <MCL>
  Thin Laminate  
Items Conditions Units Actual Values (t0.8mm) Test Method (IPC TM-650)
 Dielectric Constant 1MHz C-96/20/65 -- 4.8 ~ 5.0
 Dissipation Factor 1MHz C-96/20/65 -- 0.0080 ~ 0.100
 Tg TMA ‹C 160 ~ 170 2.4.24
 Flexural Modulus  (Lengthwise) A GPa 27 ~ 33 2.4.4
 CTE*1 X (30`120‹C) ppm/‹C 12 ~ 14 2.4.24
Y 12 ~ 14
Z (<Tg) 20 ~ 30
(>Tg) 130 ~ 160
 Copper Peel Strength 18ƒÊm A kN/m 1.1 ~ 1.2 2.4.8
 Water Absorption   E-24/50+D-24/23 % 0.03 ~ 0.05
     Halogen Free, Low Dielectric       Constant, High Heat Resistance       Multilayer Material <MCL>
     Halegon Free, Low Dielectric       Constant, Low Dissipation Factor       Multilayer Material <MCL>
     Glass Epoxy Copper Clad              Laminate (FR-4)
     Low Press Temperature, Adhesive       Film (AS-2600)
  Printed Wiring Boards
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  *1): Heating Rate: 10‹C/min.      HOME
         Hitachi Chemical. Co, Ltd.
Type Glass Cloth Properties
(g/m 2)
Yarn Count (warpxfill) Resin Content
Volatile Content
Gelation Time (sec.)
Dielectric Thickness after Lamination *1 (mm)
 R  Type  0.04 FRZPE
24 69x72 73}2 <0.1 115}25 0.048
 0.06 FREOE
48 53x53 68}2 110}25 0.078
 0.1 FRSKE
104 60x58 58}2 <0.75 0.125
  *1) : The dielectric thickness after lamination is defined as the thickness of one sheet of  
  prepreg when the resin flow is within 5%.  
  This value changes according to the press condition and inner-layer pattern.