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               Electronics-Related Materials
  MCL-E-679 E GEA-679N <prepreg> inquiry   Semiconductor-Related
    These FR-5 equivalent materials offer increased Tg (175 TMA) and improved through-hole reliability. minimal water absorption rates of less than 50% of conventional FR-4s, these materials use advanced resin technology to offer superior CAF restraining property and better It is suitable for the substrate of plastic BGA.   Display & Optics-Related
      Base Materials for PWBs
       Glass Epoxy Multilayer Material
       Halogen Free Multilayer Material
       High Heat Resistance       Multilayer Material (FR-4)
           High Tg Glass Epoxy Multilayer       Material <MCL>
    Features      High Elastic Modulus, Low CTE       Glass Epoxy Multilayer Material
  High Tg & excellent through hole reliability  
  Superior moisture resistance and good insulation resistance      Halogen Free, High Elastic        Modulus, Low CTE Mulilayer        Material
  High heat resistance after water absorption  
  Good processability(for drilling punching)  
         High Elastic Modulus, Low CTE       Multilayer Materials for       Thin Package Substrates <MCL>
         Low Dissipation Factor, High          Heat Resistance Multilayer       aterial
         Low Transmission Loss Material
         Low Dielectric Constant, Low       Dissipation Factor, High Heat       Resistance MultilayerMaterial       <MCL>
         Halogen Free, Low Dielectric       Constant, High Heat Resistance       Multilayer Material <MCL>
         Halegon Free, Low Dielectric       Constant, Low Dissipation Factor       Multilayer Material <MCL>
         Glass Epoxy Copper Clad              Laminate (FR-4)
         Low Press Temperature, Adhesive       Film (AS-2600)
      Printed Wiring Boards
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