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               Electronics-Related Materials
  MCL-E-67 EGEA-67N <prepreg> inquiry   Semiconductor-Related
    Type No. MCL-E-67 is a FR-4 multilayer material which has excellent properties of CAF as well as various electric and mechanical properties. This material is suitable for cellular phone, electric switching equipment, PCs and wide range of other applications.   Display & Optics-Related
      Base Materials for PWBs
         Glass Epoxy Multilayer Material
       Halogen Free Multilayer Material
       High Heat Resistance Multilayer       Material (FR-4)
     
         High Tg Glass Epoxy Multilayer       Material <MCL>
           
    Features      High Elastic Modulus, Low CTE       Glass Epoxy Multilayer Material
  Excellent CAF property.  
  Excellent electric and mechanical properties.      Halogen Free, High Elastic        Modulus, Low CTE Mulilayer        Material
  Reduction in secondary lamination time, depending on the type of prepreg and the  
          lamination condition.  
          Please be noted that this product is not made specifically for the application of short-time      High Elastic Modulus, Low CTE       Multilayer Materials for       Thin Package Substrates <MCL>
          lamination.  
     
         Low Dissipation Factor, High          Heat Resistance Multilayer       aterial
     
     
         Low Transmission Loss Material
         Low Dielectric Constant, Low       Dissipation Factor, High Heat       Resistance MultilayerMaterial       <MCL>
     
     
     
         Halogen Free, Low Dielectric       Constant, High Heat Resistance       Multilayer Material <MCL>
     
     
         Halegon Free, Low Dielectric       Constant, Low Dissipation Factor       Multilayer Material <MCL>
     
     
         Glass Epoxy Copper Clad              Laminate (FR-4)
     
         Low Press Temperature, Adhesive       Film (AS-2600)
     
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